Solder alloy

US9221131B2 · kind B2 · utility

Assignee

• Alpha Metals, Inc. · US

Inventors

• Anthony E. Ingham · Chiswick, GB
• Gerard Campbell · Mansfield Center, US
• Brian G. Lewis · Branford, US
• Bawa Singh · Cherry Hill, US
• John P. Laughlin · Tucson, US
• Ranjit Pandher · South Plainfield, US

Key dates

• Filing date: Dec 1, 2005
• Grant date: Dec 29, 2015
• Expiry date: Jul 27, 2028

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C22C13/02
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.