3D bond and assembly process for severely bowed interposer die
US9224712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2014 |
| Grant date | Dec 29, 2015 |
| Priority date | — |
| Expiry date | Feb 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interposer structure containing a first set of solder balls is placed in proximity to a vacuum distribution plate which has a planar contact surface and a plurality of openings located therein. A vacuum is then applied through the openings within the vacuum distribution plate such that the first set of solder balls are suspended within the plurality of openings and the interposer structure conforms to the planar contact surface of the vacuum distribution plate. A semiconductor chip containing a second set of solder balls is tacked to a surface of the interposer structure. A substrate is then brought into contact with a surface of the interposer structure containing the first set of solder balls, and then a solder reflow and underfill processes can be performed. Warping of the interposer structure is substantially eliminated using the vacuum distribution plate mentioned above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.