Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
US9230919B2 · kind B2 · utility
1Cited by
17References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2014 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Oct 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.