Self-healing crack stop structure
US9230921B2 · kind B2 · utility
4Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2013 |
| Grant date | Jan 5, 2016 |
| Priority date | — |
| Expiry date | Nov 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A self-healing crack stop structure and methods of manufacture are disclosed herein. The structure comprises a crack stop structure formed in one or more dielectric layers and surrounding an active region of an integrated circuit chip. The crack stop comprises self healing material which, upon propagation of a crack, is structured to seal the crack and prevent further propagation of the crack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.