Patent · US Active

Semiconductor package with grounding and shielding layers

US9236356B2 · kind B2 · utility

15Cited by

55References

17Claims

0Family size

Assignee

ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventors

Jun Yang · Zhaoqing, CN
Sung Mook LIM · Seoul, KR

Key dates

Filing date	Jul 30, 2014
Grant date	Jan 12, 2016
Priority date	—
Expiry date	Jul 30, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a substrate, a grounding layer, a chip, a package body, and a shielding layer. The substrate includes a lateral surface and a bottom surface. The grounding layer is buried in the substrate and extends horizontally in the substrate. The chip is arranged on the substrate. The package body envelops the chip and includes a lateral surface. The shielding layer covers the lateral surface of the package body and the lateral surface of the substrate, and is electrically connected to the grounding layer, where a bottom surface of the shielding layer is separated from a bottom surface of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.