Carrier-less silicon interposer
US9237648B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2013 |
| Grant date | Jan 12, 2016 |
| Priority date | — |
| Expiry date | Feb 9, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interposer has conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component includes a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. A conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.