Stackable package by using internal stacking modules
US9245772B2 · kind B2 · utility
3Cited by
12References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2014 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Jul 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package comprises a substrate, a first semiconductor die mounted to the substrate, and a first double side mold (DSM) internal stackable module (ISM) bonded directly to the first semiconductor die through a first adhesive. The first DSM ISM includes a first molding compound, and a second semiconductor die disposed in the first molding compound. The semiconductor package further comprises a first electrical connection coupled between the first semiconductor die and the substrate, and a second electrical connection coupled between the first DSM ISM and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.