Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
US9245777B2 · kind B2 · utility
9Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2013 |
| Grant date | Jan 26, 2016 |
| Priority date | — |
| Expiry date | Sep 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67023
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a disc-shaped article comprises a spin chuck and at least three individually controllable infrared heating elements. The infrared heating elements are mounted in a stationary manner with respect to rotation of said spin chuck. At least the transparent plate positioned between the infrared heating elements and the underside of a wafer is mounted for rotation with the spin chuck. Alternatively, the transparent plate is part of a housing that encloses the infrared heating elements and that rotates with the spin chuck as the heating elements are stationary relative thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.