Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance

US9245813B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Gerald K. Bartley · Rochester, US
• Charles L. Johnson · Rochester, US
• John E. Kelly, III · Poughquag, US
• Joseph Kuczynski · North Port, US
• David R. Motschman · Rochester, US
• Arvind K. Sinha · Rochester, US
• Kevin A. Splittstoesser · Stewartville, US
• Timothy A. Tofil · Rochester, US

Key dates

• Filing date: Jan 30, 2013
• Grant date: Jan 26, 2016
• Expiry date: Jan 30, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.