Hybrid-integrated photonic chip package with an interposer

US9250403B2 · kind B2 · utility

Assignee

• Oracle International Corporation · US

Inventors

• Hiren D. Thacker · San Diego, US
• Frankie Y. Liu · Palo Alto, US
• Robert D. Hopkins · Foster City, US
• Jon Lexau · Mountain View, US
• Xuezhe Zheng · San Diego, US
• Guoliang Li · Nanhu, CN
• Ivan Shubin · San Diego, US
• Ronald Ho · Fremont, US
• John E. Cunningham · San Diego, US
• Ashok V. Krishnamoorthy · San Diego, US

Key dates

• Filing date: Oct 7, 2013
• Grant date: Feb 2, 2016
• Expiry date: Apr 5, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10484
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.