Deposition chambers with UV treatment and methods of use
US9252024B2 · kind B2 · utility
453Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2013 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Sep 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76862
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described are apparatus and methods for processing semiconductor wafers so that a film can be deposited on the wafer and the film can be UV treated without the need to move the wafer to a separate location for treatment. The apparatus and methods include a window which is isolated from the reactive gases by a flow of an inert gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.