Extended contact area for leadframe strip testing
US9252063B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Jul 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe strip includes a plurality of unit leadframes connected to a periphery of the leadframe strip, each unit leadframe having a die paddle, a plurality of leads and a semiconductor die attached to the die paddle. The leadframe strip is tested by electrically isolating at least the leads from the periphery of the leadframe strip such that at least some of the leads extend uninterrupted beyond a final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The semiconductor dies are tested, which includes probing the die paddles and the leads that extend uninterrupted beyond the final lead outline of the unit leadframes after electrical isolation from the periphery of the leadframe strip. The unit leadframes are severed from the leadframe strip along the final lead outline of the unit leadframes after testing the semiconductor dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.