Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding
US9252130B2 · kind B2 · utility
10Cited by
5References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2013 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Jul 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of producing a semiconductor package using dual-sided thermal compression bonding includes providing a substrate having an upper surface and a lower surface. A first device having a first surface and a second surface can be provided along with a second device having a third surface and a fourth surface. The first surface of the first device can be coupled to the upper surface of the substrate while the third surface of the second device can be coupled to the lower surface of the substrate, the coupling occurring simultaneously to produce the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.