Patent · US Active

Method of word-line formation by semi-damascene process with thin protective conductor layer

US9252153B1 · kind B1 · utility

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8Claims
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Key dates

Filing dateSep 22, 2014
Grant dateFeb 2, 2016
Priority date
Expiry dateSep 22, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A semi-damascene method is described for fabricating wordlines without stringers while maintaining critical cell dimensions when wordline pitch is less than 40 nm. A thin conducting layer protects a storage layer during manufacture, the thin conducting layer then making contact with filled-in conducting material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.