Method of word-line formation by semi-damascene process with thin protective conductor layer
US9252153B1 · kind B1 · utility
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8Claims
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Key dates
| Filing date | Sep 22, 2014 |
| Grant date | Feb 2, 2016 |
| Priority date | — |
| Expiry date | Sep 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semi-damascene method is described for fabricating wordlines without stringers while maintaining critical cell dimensions when wordline pitch is less than 40 nm. A thin conducting layer protects a storage layer during manufacture, the thin conducting layer then making contact with filled-in conducting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.