Sputtering target including a feature to reduce chalcogen build up and arcing on a backing tube
US9255323B2 · kind B2 · utility
0Cited by
10References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2012 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | Nov 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.