Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device
US9257423B2 · kind B2 · utility
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1References
20Claims
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Key dates
| Filing date | Nov 26, 2013 |
| Grant date | Feb 9, 2016 |
| Priority date | — |
| Expiry date | May 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.