Calvin Leung
22Patents
6h-index
17Co-inventors
66Inventor score
Filing activity: May 12, 1995 → May 8, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5604735A | High speed network switch | Electricity | 102 | Expired |
| US7584319B1 | Connection management in serial attached SCSI (SAS) expanders | Physics | 42 | Active |
| US8436426B2 | Multi-layer via-less thin film resistor | Electricity | 21 | Active |
| US8400257B2 | Via-less thin film resistor with a dielectric cap | Emerging Cross-Sectional Technologies | 16 | Active |
| US8095722B1 | Connection management in serial attached SCSI (SAS) expanders | Physics | 14 | Active |
| US9176089B2 | Integrated multi-sensor module | Electricity | 8 | Active |
| US8558654B2 | Vialess integration for dual thin films—thin film resistor and heater | Electricity | 6 | Active |
| US8786396B2 | Heater design for heat-trimmed thin film resistors | Electricity | 5 | Active |
| US8659085B2 | Lateral connection for a via-less thin film resistor | Electricity | 4 | Active |
| US10317357B2 | Integrated multi-sensor module | Electricity | 4 | Active |
| US9689824B2 | Integrated multi-sensor module | Electricity | 3 | Active |
| US10094797B2 | Integrated multi-sensor module | Electricity | 2 | Active |
| US9866658B2 | Method and apparatus for SAS open address frame processing in SAS expanders | Electricity | 1 | Active |
| US9651627B2 | Accumulated power consumption sensor: application in smart batteries systems | Electricity | 1 | Active |
| US8809861B2 | Thin film metal-dielectric-metal transistor | Emerging Cross-Sectional Technologies | 1 | Active |
| US9918667B2 | Flexible electrochemical micro-sensor | Physics | 1 | Active |
| US10299711B2 | Flexible electrochemical micro-sensor | Physics | 0 | Active |
| US9437798B2 | Combo bio and temperature disposable sensor on flexible foil | Emerging Cross-Sectional Technologies | 0 | Active |
| US10905362B2 | Flexible electrochemical micro-sensor | Physics | 0 | Active |
| US9257423B2 | Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device | Electricity | 0 | Active |
| US11009477B2 | Integrated multi-sensor module | Electricity | 0 | Active |
| US9530681B2 | Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.