Patent · US Active

Lead-free solder alloys and solder joints thereof with improved drop impact resistance

US9260768B2 · kind B2 · utility

1Cited by

4References

20Claims

0Family size

Assignee

INDIUM CORPORATION · US

Inventors

Weiping Liu · New Hartford, US
Ning-Cheng Lee · New Hartford, US

Key dates

Filing date	Dec 6, 2006
Grant date	Feb 16, 2016
Priority date	—
Expiry date	Feb 6, 2029

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC22C13/02
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably contain 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.