Liquid cooling of semiconductor chips utilizing small scale structures
US9263366B2 · kind B2 · utility
4Cited by
26References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2014 |
| Grant date | Feb 16, 2016 |
| Priority date | — |
| Expiry date | May 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.