Patent · US Active

Lead frame strips with electrical isolation of die paddles

US9263419B2 · kind B2 · utility

3Cited by

4References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Nee Wan Khoo · Melaka City, MY
Lay Yeap Lim · Bukit Mertajam, MY

Key dates

Filing date	Aug 30, 2013
Grant date	Feb 16, 2016
Priority date	—
Expiry date	Aug 30, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A lead frame strip includes connected unit lead frames each having a die paddle, a tie bar directly connecting the die paddle to a periphery of the unit lead frame, leads directly connected to the periphery of the unit lead frame and projecting toward the die paddle, and an opening in the periphery adjacent the tie bar. The openings in the periphery of the unit lead frames are spanned with an electrically insulating material that connects the tie bar of each unit lead frame to the periphery of the unit lead frame. The direct connections between the tie bars and the periphery of the unit lead frames are severed prior to subsequent processing, so that the tie bars remain connected to the periphery of the unit lead frames by the electrically insulating material and the die paddles are electrically disconnected from the periphery of the unit lead frames.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.