Patent · US Active

Semiconductor device having multiple chips mounted to a carrier

US9263421B2 · kind B2 · utility

0Cited by

2References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Boon Seong Lee · Melaka City, MY
Chee Voon Tan · Seremban, MY

Key dates

Filing date	Feb 28, 2014
Grant date	Feb 16, 2016
Priority date	—
Expiry date	Feb 28, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a chip carrier having a first surface and a second surface opposite to the first surface. The device further includes a first semiconductor chip mounted on the first surface of the chip carrier. A second semiconductor chip is mounted on the second surface of the chip carrier, wherein a portion of a first surface of the second semiconductor chip which faces the chip carrier projects over an edge of the chip carrier. A first electrical conductor is coupled to an electrode formed on the portion of the first surface of the second semiconductor chip that projects over the edge of the chip carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.