Patent · US Active

Independent control of stacked electronic modules

US9269403B2 · kind B2 · utility

0Cited by
2References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 6, 2015
Grant dateFeb 23, 2016
Priority date—
Expiry dateFeb 6, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/181
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Various embodiments of apparatuses are disclosed to allow independent control of stacked modules. In one embodiment, an apparatus may include a plurality of stacked memory dice, with at least some of the plurality of stacked memory dice include a Chip Enable (CE) signal connection electrically accessible from a surface of a corresponding one of the dice. Each of the stacked dice having the CE signal connection is controllable individually by a unique CE signal applied to the CE signal connection. Other apparatuses are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.