Ephemeral bonding

US9269623B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials LLC · US

Inventors

• Mark S. Oliver · Boston, US
• Michael K. Gallagher · Hopkinton, US
• Karen R. Brantl · West Springfield, US

Key dates

• Filing date: Oct 22, 2013
• Grant date: Feb 23, 2016
• Expiry date: Jan 30, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2221/68381
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.