Mark S. Oliver
8Patents
1h-index
8Co-inventors
33Inventor score
Filing activity: Oct 22, 2013 → Oct 12, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9269623B2 | Ephemeral bonding | Electricity | 3 | Active |
| US9296915B1 | Toughened arylcyclobutene polymers | Electricity | 1 | Active |
| US9644118B2 | Method of releasably attaching a semiconductor substrate to a carrier | Electricity | 0 | Active |
| US9493686B2 | Ephemeral bonding | Electricity | 0 | Active |
| US9315696B2 | Ephemeral bonding | Emerging Cross-Sectional Technologies | 0 | Active |
| US9518194B2 | Toughened arylcyclobutene polymers | Electricity | 0 | Active |
| US9909040B2 | Ephemeral bonding | Emerging Cross-Sectional Technologies | 0 | Active |
| US9818636B2 | Ephemeral bonding | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.