Bond pad structure and method of manufacturing the same
US9269678B2 · kind B2 · utility
3Cited by
5References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 25, 2012 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Mar 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a bond pad structure, comprising the steps of forming a pad material layer on a passivation layer, forming a protection layer on the pad material layer, performing an etching process to pattern the protection layer and the pad material layer into a bond pad structure, and removing the protection layer on the bond pad structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.