Packages with thermal management features for reduced thermal crosstalk and methods of forming same
US9269694B2 · kind B2 · utility
16Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2013 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Jan 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.