Process integration of a single chip three axis magnetic field sensor
US9269891B2 · kind B2 · utility
8Cited by
28References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2013 |
| Grant date | Feb 23, 2016 |
| Priority date | — |
| Expiry date | Oct 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N59/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.