Patent · US Active

Removable indicator structure in electronic chips of a common substrate for process adjustment

US9275916B2 · kind B2 · utility

2Cited by

3References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edward Fuergut · Nuremberg, DE
Irmgard Escher-Poeppel · Regensburg, DE
Manfred Engelhardt · Feldkirchen-Westerham, DE
Hans-Joerg Timme · Ottobrunn, DE
Hannes Eder · Villach, AT

Key dates

Filing date	May 3, 2013
Grant date	Mar 1, 2016
Priority date	—
Expiry date	Sep 20, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18162
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of processing a plurality of packaged electronic chips being connected to one another in a common substrate is provided, wherein the method comprises etching the electronic chips, detecting information indicative of an at least partial removal of an indicator structure following an exposure of the indicator structure embedded within at least a part of the electronic chips and being exposed after the etching has removed chip material above the indicator structure, and adjusting the processing upon detecting the information indicative of the at least partial removal of the indicator structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.