Patent · US Active

Low cost high frequency device package and methods

US9275961B2 · kind B2 · utility

0Cited by

51References

14Claims

0Family size

Assignee

Rosenberger Hochfrequenztechnik GmbH & Co. KG · DE

Inventors

Eric A. Sanjuan · San Jose, US
Sean S. Cahill · Palo Alto, US

Key dates

Filing date	May 31, 2012
Grant date	Mar 1, 2016
Priority date	—
Expiry date	Feb 19, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A low-cost high-frequency electronic device package and associated fabrication method are described wherein waveguide structures are formed from the high frequency device to the package lead transition. The package lead transition is optimized to take advantage of waveguide interconnect structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.