Chip scale module package in BGA semiconductor package
US9281300B2 · kind B2 · utility
8Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2010 |
| Grant date | Mar 8, 2016 |
| Priority date | — |
| Expiry date | Jul 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a ball grid array (BGA) substrate having integrated metal layer circuitry, a flip chip chip scale module package (CSMP) having a first integrated passive device (IPD), the flip chip chip scale module package attached to the BGA substrate, and an application die attached to the IPD. A method of manufacturing a semiconductor package includes providing a BGA substrate having integrated metal layer circuitry, attaching a flip chip CSMP having a first IPD to the BGA substrate, and attaching an application die to the IPD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.