Module for ozone cure and post-cure moisture treatment
US9285168B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2011 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Nov 11, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing system that has a plurality of deposition chambers, and one or more robotic arms for moving a substrate between one or more of a deposition chamber, load lock holding area, and a curing and treatment module. The substrate curing and treatment module is attached to the load-lock substrate holding area, and may include: The curing chamber for curing a dielectric layer in an atmosphere comprising ozone, and a treatment chamber for treating the cured dielectric layer in an atmosphere comprising water vapor. The chambers may be vertically aligned, have one or more access doors, and may include a heating system to adjust the curing and/or heating chambers between two or more temperatures respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.