Patent · US Active

Apparatuses and methods for die seal crack detection

US9287184B2 · kind B2 · utility

12Cited by

1References

9Claims

0Family size

Assignee

Micron Technology, Inc. · US

Inventors

Charles H. Dennison · San Jose, US
Kenneth W. Marr · Boise, US
Deepak Thimmegowda · Fremont, US
Philip J. Ireland · Nampa, US

Key dates

Filing date	Dec 13, 2013
Grant date	Mar 15, 2016
Priority date	—
Expiry date	Dec 13, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH10D30/655
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Apparatuses and methods can include a die seal between an integrated circuit region of a die and a periphery of the die. A via chain(s) may be arranged around an inner circumference of the die seal between the die seal and the integrated circuit region and/or around an outer circumference of the die seal between the die seal and the periphery of the die. The via chain may include a plurality of contacts comprised of conductive material and extending through portions of the die. Circuitry may be coupled to an end of the via chain to detect an electrical signal. Additional apparatuses and methods are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.