LED submount with integrated interconnects
US9287468B2 · kind B2 · utility
4Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2014 |
| Grant date | Mar 15, 2016 |
| Priority date | — |
| Expiry date | Nov 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
Abstract
A submount for light emitting diode (LED) die includes a substrate containing a plurality of tubs configured to receive an LED die, and a plurality of integrated interconnects integrated into the substrate. At least a portion of the interconnects for each tub have an exposed portion on a side of the submount and at least some of the plurality of the interconnects are not connected to other interconnects in the submount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.