Method for fabricating wire bonding structure
US9289846B2 · kind B2 · utility
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11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2013 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Jan 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.