Plasma thermal shield for heat dissipation in plasma chamber
US9293304B2 · kind B2 · utility
1Cited by
59References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2013 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Feb 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68377
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a plasma thermal shield for a plasma processing chamber includes an annular ring body having an inner opening. A plasma-facing surface of the annular ring body has a general topography. A bottom surface of the annular ring body reciprocates the general topography with recessed regions disposed therein, providing one or more protruding regions at the bottom surface of the annular ring body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.