Removal of metal
US9293319B2 · kind B2 · utility
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1References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2011 |
| Grant date | Mar 22, 2016 |
| Priority date | — |
| Expiry date | Dec 14, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of removing metal from a portion of a substrate are useful in integrated circuit fabrication. Methods include exposing the substrate to an oxidizing environment comprising at least one oxidizing agent and at least one reducing agent, and exposing the substrate to a reducing environment comprising at least one reducing agent and at least one oxidizing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.