Hybrid-integrated photonic chip package with an interposer

US9297971B2 · kind B2 · utility

Assignee

• Oracle International Corporation · US

Inventors

• Hiren D. Thacker · San Diego, US
• Ashok V. Krishnamoorthy · San Diego, US
• Robert D. Hopkins · Foster City, US
• Jon Lexau · Mountain View, US
• Xuezhe Zheng · San Diego, US
• Ronald Ho · Fremont, US
• Ivan Shubin · San Diego, US
• John E. Cunningham · San Diego, US

Key dates

• Filing date: Oct 7, 2013
• Grant date: Mar 29, 2016
• Expiry date: Oct 7, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10484
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.