Patent · US Active

Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith

US9299673B2 · kind B2 · utility

0Cited by

2References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Peter Ossimitz · Munich, DE
Matthias von Daak · Borgo San Lazzaro, DE
Dirk Hesidenz · Sauerlach, DE

Key dates

Filing date	May 28, 2014
Grant date	Mar 29, 2016
Priority date	—
Expiry date	May 28, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the present invention relate to a semiconductor chip comprising a plurality of contact pads, which are arranged in an edge area on a surface of the semiconductor chip. In a semiconductor area of the semiconductor chip, every contact pad of the plurality of contact pads has an associated pad cell provided, which includes at least one of a driver or a receiver and is configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver is connected to the contact pad. Additionally, for a contact pad which is used as a supply contact pad, the driver or receiver of the associated pad cell is not connected to the contact pad or any other contact pad for driving output signals or receiving input signals on the same.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.