Monolithic body MEMS devices
US9300227B2 · kind B2 · utility
1Cited by
9References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2013 |
| Grant date | Mar 29, 2016 |
| Priority date | — |
| Expiry date | Oct 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A technique decouples a MEMS device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.