Baseplate for an electronic module and method of manufacturing the same
US9305874B2 · kind B2 · utility
0Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2014 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Apr 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments provide a baseplate for an electronic module, wherein the baseplate comprises a conductive material; and a recess formed in one main surface of the baseplate and being adapted to accommodate an electronic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.