Substrate cleaning method, substrate cleaning apparatus and storage medium for cleaning substrate
US9307653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2013 |
| Grant date | Apr 5, 2016 |
| Priority date | — |
| Expiry date | Apr 6, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1509
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A substrate cleaning method is capable of preventing a liquid stream on a substrate from being cut and circuit patterns thereon from being damaged. The substrate cleaning method includes a liquid film forming process that forms a liquid film on an entire substrate surface by supplying a cleaning liquid L from a central portion of the substrate W toward a peripheral portion thereof while rotating the substrate; a drying region forming process that discharges a gas G on the substrate surface and removes the cleaning liquid on the substrate surface; and a residual liquid removing process that removes the cleaning liquid remaining between the circuit patterns by discharging a gas G while moving in a diametrical direction of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.