Linear prediction for filtering of data during in-situ monitoring of polishing
US9308618B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 26, 2012 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Oct 12, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of controlling polishing includes polishing a substrate, during polishing monitoring the substrate with an in-situ monitoring system, the monitoring including generating a signal from a sensor, and filtering the signal to generate a filtered signal. The signal includes a sequence of measured values, and the filtered signal including a sequence of adjusted values. The filtering includes for each adjusted value in the sequence of adjusted values, generating at least one predicted value from the sequence of measured values using linear prediction, and calculating the adjusted value from the sequence of measured values and the predicted value. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the filtered signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.