Method of manufacturing semiconductor devices including generating and annealing radiation-induced crystal defects
US9312135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2014 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Apr 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/66
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The generation of auxiliary crystal defects is induced in a semiconductor substrate. Then the semiconductor substrate is pre-annealed at a temperature above a dissociation temperature at which the auxiliary crystal defects transform into defect complexes, which may be electrically inactive. Then protons may be implanted into the semiconductor substrate to induce the generation of radiation-induced main crystal defects. The defect complexes may enhance the efficiency of the formation of particle-related dopants based on the radiation-induced main crystal defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.