Through mold via relief gutter on molded laser package (MLP) packages
US9313881B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2013 |
| Grant date | Apr 12, 2016 |
| Priority date | — |
| Expiry date | Apr 1, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Improved Molded Laser Package (MLP) Packages which include a relief path for pressure and reduces the risk of shorting adjacent solder balls are provided. The MLP packages may include a gutter integrally connected to one or more through mold vias allowing a path to relieve pressure created when moisture gets entrapped in through mold vias, during the manufacturing process, while also reducing the risk of solder shorts between adjacent solder balls located in the through mold vias. Additionally, MLP packages which include gutters integrally connected to one or more through mold vias may enable tighter bump pitch and thinner packages. As a result, process margins and risks associated with surface mount technology (SMT) may be improved and provide more flexibility on inventory staging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.