Ductile mode drilling methods for brittle components of plasma processing apparatuses
US9314854B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2013 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Sep 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T408/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of drilling holes comprises ductile mode drilling the holes in a component of a plasma processing apparatus with a cutting tool wherein the component is made of a nonmetallic hard and brittle material. The method comprises drilling each hole in the component by controlling a depth of cut while drilling such that a portion of the brittle material undergoes high pressure phase transformation and forms amorphous portions of the brittle material during chip formation. The amorphous portions of the brittle material are removed from each hole such that a wall of each hole formed in the component has an as drilled surface roughness (Ra) of about 0.2 to 0.8 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.