Patent · US Active

Ephemeral bonding

US9315696B2 · kind B2 · utility

0Cited by

9References

14Claims

0Family size

Assignees

DOW GLOBAL TECHNOLOGIES LLC · US
Rohm and Haas Electronic Materials LLC · US

Inventors

Zhifeng Bai · Midland, US
Mark S. Oliver · Boston, US
Michael K. Gallagher · Hopkinton, US
Christopher J. Tucker · Midland, US
Karen R. Brantl · West Springfield, US
Elissei Iagodkine · Marlborough, US
Zidong Wang · Southborough, US

Key dates

Filing date	Oct 31, 2013
Grant date	Apr 19, 2016
Priority date	—
Expiry date	Mar 5, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2848
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.