Patent · US Active

Ball grid array configuration for reliable testing

US9322848B2 · kind B2 · utility

2Cited by

6References

7Claims

0Family size

Assignee

GlobalFoundries Inc. · KY

Inventors

Otto A. Torreiter · Echterdingen, DE
Dieter Wendel · Schenefeld, DE

Key dates

Filing date	Jul 3, 2013
Grant date	Apr 26, 2016
Priority date	—
Expiry date	Oct 15, 2033

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2601
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A semiconductor die with an array of contacts, where at least two contacts in adjacent positions have the same data signal during testing operations with a test probe. The adjacent contacts of the cluster allow the use of a larger test probe tip and/or greater tolerance on test probe tip alignment during testing operations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.