Machining process for semiconductor wafer
US9324558B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2014 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Jun 20, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A surface of a semiconductor wafer is subjected to high flattening processing.A resin application and grinding step is repeatedly carried out, the step including determining as a reference surface a flat surface obtained by applying a curable material to one entire surface of a wafer sliced out from a semiconductor single crystal ingot with the use of a wire saw apparatus and performing surface grinding with respect to the other surface of the wafer, and determining as a reference surface the other surface of the wafer subjected to the surface grinding and performing the surface grinding with respect to the one surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.