Low temperature adhesive resins for wafer bonding
US9324601B1 · kind B1 · utility
6Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2014 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Nov 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.