Use of electrolytic plating to control solder wetting
US9324669B2 · kind B2 · utility
4Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2014 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Sep 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method including forming a copper pillar, electroplating a metal layer on a top surface and a sidewall of the copper pillar, and electroplating a metal cap above the top surface of the copper pillar in direct contact with the metal layer. The method further including forming an intermetallic by heating the metal layer and the copper pillar in a non-reducing environment, the intermetallic including elements of both the copper pillar and the metal layer, where molten solder will wet to the metal cap and will not wet to the intermetallic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.